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Online ISSN: 2578-3769


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Current Status of the Integrated Circuit Industry in ChinaEDA Industry Review
Authors: Litho World
Volume 2, Issue 3: 19020305, 2019 | PDF
Research Article
Published: Sept. 29, 2019
Abstract: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
An Innovative Method to Improve Model Accuracy by Implementing Multi-models Scheme for 28nm Node and Below
Authors: Qingchen Cao, Tianhui Li, Deyuan Xiao
Institution:SiEn (QingDao) Integrated Circuits Co., Ltd
Keywords:Image quality;lithography;OPC model;multi-model
Volume 2, Issue 3: 19020304, 2019 | PDF
Research Article
Published: Sept. 28, 2019
Abstract: As the process comes into 28nm node and below, lithography struggles stronger between high resolution (high NA) and enough process window especially for hole layers (Contacts and Vias). Taking more...
Influence of Chemical Stability on the Fabrication of MnGa-based Devices
Authors: Lijun Zhu, Jianhua Zhao
Institution:Cornell University
Keywords:Keyword: Chemical stability, Perpendicular magnetic anisotropy, Spintronics, Wet etching
Volume 2, Issue 3: 19020303, 2019 | PDF
Published: Sept. 26, 2019
Abstract: Ferromagnetic films of L10-ordered MnGa have shown promise not only in the applications in ultrahigh-density magnetic recording and spintronic memories, oscillators, and sensors, ...
A Flexible Pressure Sensor Based on Poly(dimethylsiloxane) Nanostructures Film
Authors: Man Zhang, Liangping Xia, Suihu Dang et al.
Institution:Yangtze Normal University
Keywords:Flexible;pressure sensor;poly(dimethylsiloxane);soft nanoimprint lithography;triboelectrostatic charges
Volume 2, Issue 3: 19020302, 2019 | PDF
Published: Sept. 26, 2019
Abstract: This paper proposed a flexible pressure sensor based on poly(dimethylsiloxane) nanostructures film and report an efficient, simple, and low-cost fabrication strategy via soft nanoimprint lithograph...
Innovation on Line Cut Methods of Self-aligned Multiple Patterning
Authors: Jeff Shu
Keywords:self-aligned multiple patterning;SAMP;self-aligned double patterning;SADP;self-aligned quadruple patterning;SAQP;line cut;edge placement error
Volume 2, Issue 3: 19020301, 2019 | PDF
Research Article
Published: Sept. 25, 2019
Abstract: Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeati...