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Silicon Nitride Etch via Oxidation Reaction in Fluorocarbon/Oxygen Plasma: A First-Principle Study
Authors: Yu-Hao Tsai, Du Zhang, Mingmei Wang
Institution:TEL Technology Center
Keywords:3D-NAND;oxide;nitride;oxynitride;plasma etch;first-principle
doi:10.33079/jomm.18010102
Volume 1, Issue 1: 18010102, 2018 | PDF
Research Article
Published: Sept. 30, 2018
Views:767
Abstract: Conducting all-in-one etch process for 3D-NAND fabrication requires close etch rate (E/R) for SiO2 and Si3N4; however, to attain comparable and high etch rate for b...
A Novel High Volume Manufacturing Method for Defect-free and High-yield SiN Micro-sieve Membranes
Authors: Yansong Liu, Chao Zhao, Lisong Dong et al.
Institution:Key Laboratory of Microelectronic Devices, &, Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
Keywords:micro-sieves;high volume manufacturing;defect free;high yield
doi:10.33079/jomm.18010103
Volume 1, Issue 1: 18010103, 2018 | PDF
Research Article
Published: Sept. 30, 2018
Views:529
Abstract: Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due...