Welcome to Journal of Microelectronic Manufacturing!
Volume 2, Issue 2
  • Published: June 30, 2019
  • Supervised by:None
  • Hosted by:None
  • Published by:JoMM Editorial Office

Research Article top

Issue 2: 19020205, 2019 | PDF
Research Article
Published: June 28, 2019
Development and Prospect of Process Models and Simulation Methods for Atomic Layer Deposition
Authors: Lei Qu, Rui Chen, Xiaoting Li et al.
Institution:North China University of Technology, China
Keywords:thin film deposition;atomic layer deposition;growth model;prediction model;simulation method
Issue 2: 19020204, 2019 | PDF
Research Article
Published: June 26, 2019
Abstract: Thin film deposition is one of the most important processes in IC manufacturing. In this paper, several typical models and numerical simulation methods for thin film deposition and atomic layer dep...
Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images
Authors: Yu Zhang, Abhishek Vikram, Ming Tian et al.
Institution:Shanghai Huali Microelectronics Corp, ., Pudong District, Shanghai
Keywords:Die-to-database Pattern Monitor;After Develop Inspection (ADI);After Etch Inspection (AEI);SEM Review;CDSEM;pattern centric;pattern monitor
Issue 2: 19020203, 2019 | PDF
Research Article
Published: June 28, 2019
Abstract: Normally the optical wafer inspection tools are used for advanced process control in high volume manufacturing of semiconductor devices. The SEM Review is done for limited sample of inspection defe...
EUV Lithography: State-of-the-Art Review
Authors: Nan Fu, Yanxiang Liu, Xiaolong Ma et al.
Institution:HiSilicon Technologies Co, ., Ltd, Shanghai
Keywords:EUV lithography;EUV review;mask 3D;line edge roughness;EUV light source
Issue 2: 19020202, 2019 | PDF
Research Article
Published: June 19, 2019
Abstract: Although several years delayed than its initial plan, extreme UV lithography (EUVL) with 13.5nm wavelength has been finally implemented into high volume manufacture (HVM) of mainstream semiconducto...
Hard IP Core Nondestructive Testing Technology
Authors: Kun Yu, Hua Wang
Institution:Sino IC Technology Co, ., Ltd, ., Shanghai
Keywords:hard IP core;system on chip (SOC);testing technology;evaluation circuit;memory;automatic test equipment (ATE)
Issue 2: 19020201, 2019 | PDF
Research Article
Published: June 10, 2019
Abstract: Based on the analysis of the existing hard IP core testing technology, the hard IP core nondestructive testing technology was studied, according to the verification requirements of a large number o...